从Linley技术大会看主流厂商动态
作者 interlaken | 2010-04-09 20:40 | 类型 行业动感 | 7条用户评论 »
大名鼎鼎的Linley将于5月18-19号在美国San Jose举行春季技术大会,为各路神仙继续提供PK场地。今年的新式武器展示主要集中在处理器、数据中心以及安全领域。Linley Group的senior分析师首先会为企业和数据中心设备的设计者综述市场、技术、设备研发和芯片的趋势,其后END的执行编辑会主持一个专家论坛讨论数据中心的趋势及其对下一代系统设计的影响(八卦:EDN品牌和亚洲资产被Canon Communications LLC收购了,前浪总是要死在沙滩上)。 最吸引人的还是各个speaker的主题,按照兴趣简单罗列点评一下,一家之言,欢迎拍砖。 安全相关: -AppliedMicro senior systems architect, Satish Sathe, “Architectural Considerations for Secure Communications on Network and Storage Interfaces” -Cavium Networks distinguished engineer, Rajan Goyal, “Enabling Intelligent and Secure Networks using L7 Content Processors with Next-Gen DPI Technology” -AuthenTec worldwide systems engineering manager, mobile and network security solutions, Steve Singer, “How to Create a Trusted Platform Solution using Cryptographic Hardware and Software” -NetLogic Microsystems senior director of product line management, multi-core processors, Jim Johnston, “Scaling Processor Solutions to Meet 10/40Gbps Network Security Challenges” 处理器相关: -Freescale chief systems engineer, Kent Fisher, “Application of Multicore Processors in Data Center Networking Equipment” -LSI director, enterprise solutions marketing, networking components Division, Manish Muthal, “Asymmetric Multicore Architecture for Multiservice Applications” -Netronome senior director, strategic marketing, Nabil Damouny,”The Cloud Needs a Specialized Processor” -Marvell senior director of marketing, Viren Shah, “Marvell Single Core and SMP Architectures for Enterprise Applications” 物理层及网络相关: -AppliedMicro director of technology, CTO office, Brad Booth, “Physical Layer Design Considerations for Converged Networks” -IDT director of software engineering, Kwok Kwong, “Using PCIe as a System Interconnect in Multiprocessor Systems” -Chelsio Communications system architect, Wael Noureddine, “An Advanced Switch Memory Architecture” -Fulcrum Microsystems director of product marketing, Gary Lee, “Converging LANs, SANs, and Clusters over a Unified Wire” -NetLogic Microsystems director marketing, physical layer products, Siddharth Sheth “10/40/100G PHY Solutions Optimized for Telco, Backhaul and Next Generation Data-Centers” -Netronome director, product management and field applications engineering, Daniel Proch, “I/O Virtualization: Driving Embedded x86 Designs to 40/100Gbps” -Xilinx distinguished engineer, Gordon Brebner, “Designing 40/100G Systems with Xilinx FPGAs” -Teranetics senior director of hardware and software architecture, John Dring, “How 40nm Will Drive Commercial 10GBase-T Adoption” -Intel engineering manager, storage over Ethernet products, Manoj Dhawan, “10G Ethernet: The Fabric for Consolidation” 基本上不提40/100G就不好意思开口说话,初创小公司太难混了,跟在Xilinx/Altera后面给海思/ZTE等提供IP Core也许是个不错的方向。 | |
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“从Linley技术大会看主流厂商动态”有7个回复
Broadcom那个延迟了很长时间终于出来的640G芯片功耗太大啦,而且不支持100G接口,做个48口10G的交换机又感觉浪费,很有高不成低不就的感觉,很不看好。
工艺不成熟,下一代路标就要跳到xxx,集成phy搞出的问题太多,多增加成本,性能鸡肋。预计量产要推迟到xxx。是绊脚石。为此赌上性命,不明智。
集成的10G PHY连现在主流的LRM,Twinx DAC copper都不支持,用户还得外接PHY。这个芯片问题太多了,那个先用基本上是做小白鼠啦。B公司这次真是猪头了。
这个会议是否有网站提供Slide下载呀?
B公司不x,绊脚石而已。谁先用是真x。缺乏基本判断力,犯了盲目病。同样的还有I的2x10G NIC芯片,也不支持LRM.
会议slides应该是用公司邮箱注册后可以下载的,外部邮箱比如gmail好像没法注册。
和satish sathe握一下手,顿时感觉我也见过牛人了。