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这则新闻比较耐人寻味：

一是英飞凌有圈定了除了apple之外的一个大客户；

二是Nokia没有选ST-Ericsson.

因为ST-Ericsson是集合了NXP wirelss(philips wireless )  Ericsson chip and Nokia chip于一身。肩负了代表欧洲对抗高通的重任。 不知为啥nokia读自己前部门不感冒啊

附录：

Infineon said Wednesday it is teaming with Nokia (NYSE: NOK) to create chips for the next generation of mobile broadband. The chipmaker already supplies the world’s largest handset maker with some chips, but it will be collaborating with Nokia to ensure its transceiver chips will work with Nokia’s 4G modems that use Long-Term Evolution technology. The deal could also eventually lead to Infineon supplying LTE chips for future Nokia smartphones and mobile computing devices.

The collaboration is another sign that the transition to 4G is gaining momentum, and the chip space is already seeing some stiff competition. Chip-making giantQualcomm (NSDQ: QCOM) recently introduced a new family of multi-mode chips that can support HSPA and LTE technologies at the same time. This is important because many mobile operators that are moving to 4G networks need a 3G fallback until the LTE networks are fully built out.

There is still a bit of a standards battle going on with the next generation of mobile broadband, as companies such as Clearwire andSprint Nextel (NYSE: S) are betting on WiMax technology for its 4G networks. The companies are already delivering up to 6 Mbps to mobile users in various markets, and the companies will blanket 120 million people with WiMax by the end of 2010.

The vast majority of mobile operators around the world have settled on LTE for the next generation of mobile broadband. Verizon (NYSE: VZ) Wireless has laid out the most ambitious deployment plans among the major operators; it is aiming to cover up to 30 markets with LTE networks by the end of 2010. LTE networks have the potential to provide up to 100 Mbps downlink speed, but real-life implementation will likely result in lower speeds.

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